3M™ 7000050065 5413 Film Tape, 36 yd L 0.375 in W, 2.7 mil THK, Silicone Adhesive, Polyimide Film Backing, Amber 3M™ 7000050065 | Hubbard Supply Co.
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3M™ 7000050065 5413 Film Tape, 36 yd L 0.375 in W, 2.7 mil THK, Silicone Adhesive, Polyimide Film Backing, Amber

3M™ 7000050065 5413 Film Tape, 36 yd L 0.375 in W, 2.7 mil THK, Silicone Adhesive, Polyimide Film Backing, Amber

3M™ 7000050065 5413 Film Tape, 36 yd L 0.375 in W, 2.7 mil THK, Silicone Adhesive, Polyimide Film Backing, Amber


  • Brand: 3M™
  • Mfr# : 7000050065
  • Item # : MMM 5413-3/8INX36YRD
  • UPC #: 021200161711
  • Min. Order Qty:
  • Qty. Interval:

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  • pdf Specification Sheet https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/3M_7000050064_Specification_Sheet.pdf
  • pdf Owners/User Manual https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/3M_7000050064_User_Manual.pdf

FEATURES

  • The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
  • The DuPont Kapton polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
  • Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs
  • Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity
  • Available on cardboard or polyethyelene core

DESCRIPTION

3M™ Polyimide Film Tape 5413 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high temperature applications.

3M™, 7000050065, Film Tape, Series: 5413, 36 yd Length, 0.375 in Width, 2.7 mil Thickness, Amber, 3/8 in Diameter Core, Silicone Adhesive, Polyimide Film Backing

SPECIFICATIONS

Type      :    Flame Retardant
Series      :    5413
Length      :    36 yd
Width      :    0.375 in
Thickness      :    2.7 mil
Color      :    Amber
Core Diameter      :    3/8 in
Adhesive Material      :    Silicone
Backing Material      :    Polyimide Film
Adhesion Strength      :    22 in-oz
Tensile Strength      :    33 in-lb
Maximum Operating Temperature      :    500 deg F
Minimum Operating Temperature      :    -100 deg F

APPLICATION INFO

Standard/Approvals      :    IEC 61249-2-21
Application      :    Used for PCB solder masking and other high temperature applications
Country of Origin      :    US

Documents

  • pdf Specification Sheet https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/3M_7000050064_Specification_Sheet.pdf
  • pdf Owners/User Manual https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/3M_7000050064_User_Manual.pdf